Links to a few of Fred’s articles and papers

Many of the links will take you to the BTU International web site where you will be able to download the papers. We are working on ways to allow you to get these (and other) papers directly.

Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Results – SMTAI
https://www.btu.com/document/operation-of-a-vacuum-reflow-oven/

Maintaining Reflow Oven Performance while reducing costs – Electronics Production World
https://www.btu.com/document/maintaining-oven-performance-reducing-cost-reflow-3/

Reducing Reflow Oven Costs in a Challenging Economy – SMTA San Diego
https://www.btu.com/document/reducing-reflow-costs-challenging-economy/

Reflow Oven to Oven Repeatability – Circuits Assembly Magazine
https://www.btu.com/document/smt-reflow-oven-oven-repeatability/

Why Getting Reflow Oven Thermal Profiles Right is Important – Presented at ACI Technologies
https://www.btu.com/document/thermal-profiles-getting-right-important/

Practical Thermal Profile Expectations in a Dual Lane dual Speed Reflow oven – Circuits Assembly
http://publish-it-online.com/publication/index.php?i=63120&m=&l=&p=42&pre=&ver=html5

Solar Cell Process Temperature Measurements –Global Solar Tech
https://issuu.com/trafalgarpublications/docs/global_solar_3.1_lowres/8

“Oven Adjustment Effects on a Solder Reflow Profile,” was the most viewed article in Circuits Assembly Magazine in 2009 and remained among the most viewed articles in 2010.
https://www.btu.com/document/oven-adjustment-effects-solder-reflow-profile/

Maximizing Process Control with Controlled Convection Rates – Global SMT and Packaging
https://www.btu.com/document/maximizing-process-control-controlled-convection-rates/

Effect of High Temperature Requirements for Lead Free Solder – Circuits Assembly
https://www.btu.com/document/effect-high-temperature-requirements-lead-free-solder/

Lead Free Solder Wafer Bumping, Oven Control and Solder Material Consistency are Critical – Global SMT and Packaging
https://www.btu.com/document/lead-free-solder-wafer-bumping-oven-control-solder-material-consistency-critical/

Oven Selection and Lead Free Solder – Global SMT & Packaging
https://www.btu.com/document/oven-selection-lead-free-solder/

Wafer Bump Reflow: Benefits of a Flux free Atmosphere – Industrial Heating Magazine
https://www.btu.com/about-us/knowledge-center/download-request/?doc=eyJyaWQiOjgzMSwiZGlkIjo4NDgsImZpZCI6ODQ5LCJlaWQiOiIifQ=